Email UsElectronics Manufacturing Services: Tailoring Potting Processes to Meet Unique Customer Needs
Without proper sealing, many electronic applications and components cannot function properly, and are at risk of damage from EMI, moisture, dust, and impact. As today’s electronic devices and PCBs become ever smaller, creating gaskets to fit them reliably becomes more difficult. This is where form-in-place (FIP) gasketing processes have a clear advantage.
FIP gaskets are a versatile and effective way to fill unwanted gaps and enclose sensitive parts because the seal material is applied directly to the component in question. At H&S Manufacturing Co., we specialize in precision liquid dispensing for FIP gaskets in many different applications, including board-level electronics. Learn how this advanced sealing method can be integrated directly into the manufacturing process and some of the advantages of FIP technology for board-level electronics applications.
FIP Gaskets for Board-Level Applications
Form-in-Place (FIP) gaskets are used in many electronics applications and especially PCBs to create precision seals that block particles, moisture, and electromagnetic interference (EMI). Instead of pre-formed gaskets that are installed on a board, FIP gaskets are created by dispensing a bead of liquid material, such as silicone, directly onto the surface to be sealed. Once cured the gasket is securely attached and complete.
An important goal in FIP gasketing is reducing variability or error as the bead is applied. At H&S Manufacturing Co. we use three-axis CNC machines and collaborative robots (i.e., cobots) to dispense precise volumes of high-performance polymers with great accuracy directly onto PCBs and electronic components. This equipment can reliably apply beads as small as 0.030 in. x 0.030 in.
Meeting the Requirements of Modern Electronic Assemblies
Compared to other methods of producing gaskets and seals, FIP gaskets are very well suited to modern electronic products and devices. This method offers many advantages, including:
- Cost-effectiveness. Because FIP gaskets are formed on the component to be sealed at the time of manufacturing there is no need to source, purchase, stock, or install multiple gaskets for each component.
- Design flexibility. FIP gaskets can be made from a variety of polymers including silicone. Microfluidic dispensing technology allows for extremely small, thin, or intricate seals.
- Durable seals. Fully cured FIP gaskets are permanent and effectively resist temperature extremes, vibration, and harsh environmental exposure for a long service life.
- Enhanced manufacturing capabilities. Liquid dispensing with automated equipment is highly precise and fast compared to other methods.
- Material efficiency. Liquid dispensing is a net-shape process, which means the material is in its final shape and location when applied, which virtually eliminates clean up or trimming. What’s more, the machine dispenses only as much material as each gasket requires, reducing waste.
- Precision placement. CNC-controlled systems and cobot arms are programmed with exact movements to place the dispenser at the correct location and orientation to the part, so the material is deposited in exactly the right spot cycle after cycle.
- Sensor integration. Polymer materials can be integrated with sensing technology to monitor things like operating temperatures, pressure, vibrations, and more.
Incorporating FIP Gasketing into Your Board-Level Application
When planning for FIP gaskets, there are several factors that influence the success of the final seal. Review the following, or seek advice from a trusted manufacturer like H&S, to optimize the manufacturability of the gasket.
- Material selection. Silicone is a common choice because it is durable and resists chemicals, corrosion, and UV radiation, and adheres well. Other high-performance polymers or additives may be suitable for some applications.
- Shear force required for proper adhesion.
- Needed material compression level.
- Gasket shape. This determines the complexity or simplicity of the dispensing path, including straight or curved lines and intersections. Consistent application and sealing effectiveness become more challenging when the gasket shape and path are complex.
- Tolerances. Tight gasket height and width tolerances require precision dispensing equipment.
- Base material. Surface characteristics of the components being sealed and physical design features can affect dispensing efficiency and bonding. These can include the general suitability of the base material for bonding, smoothness or roughness of the base, and grooved or non-flat features.
Additional Considerations for Successful Implementation
A successful seal starts with reliable FIP gasket manufacturing and choosing an experienced partner for the job. H&S Manufacturing Co. has expertise with precision liquid dispensing processes and the automation equipment that drives it.
Our team provides professional guidance for material selection part and gasket design optimization, and other application-critical decisions. We can work with you to develop an FIP process that meets your requirements and streamlines the manufacturing process.
Learn More About FIP Gasket Manufacturing Solutions
FIP gaskets provide excellent protection against dust, water ingress, EMI, and other potentially damaging conditions and compounds. They are a key component in many electronics and board-level applications, and by fabricating them with robotic liquid dispensers, they can be produced rapidly without risking quality or performance.
Since 1968, H&S Manufacturing Co. has provided reliable manufacturing services, expert engineering support, and responsive customer service. We are ISO 9001:2015- and AS9100-certified, ITAR-registered, and comply with AS9146.
Contact us to learn more about FIP gasket solutions and to discuss your electronics gasketing application, or request a quote to get started today!